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I5-6360U SR2JM Laptop CPU Processors Core I5 Series 4MB Cache Up To 3.1GHz

Basic Information
Certification: ORIGINAL PARTS
Model Number: i5-6360U SR2JM
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Porcessor Number: I5-6360U Product Collection: 6th Generation Core I5 Processors
Code Name: Skylake Market Segment: Mobile
Status: Launched Launch Date: Q3'15
Lithography: 14nm Use Conditon: Notebook
High Light:

laptop microprocessor

,

mobile processor laptop


Product Description

Laptop CPU Processors I5-6360U SR2JM Core I5 Series (4MB Cache,up to 3.1GHz ) - Notebook CPU

 
Core i5-6360U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in ultrabooks as well as normal notebooks.. In addition to two CPU cores with Hyper-Threading clocked at 2.0 - 3.1 GHz (2 cores: max. 2.9 GHz), the chip also integrates an Iris Graphics 540 GPU with 64 MB of dedicated eDRAM memory and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
 
Processor number i5-6360U

 

Processor number i5-64360U
Family Core i5 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2
L2 cache size (KB) 512
L3 cache size (MB) 4
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i5 Mobile
Model number
 
i5-6360U
Frequency 2000 MHz
Maximum turbo frequency 3100 MHz (1 core)
2900 MHz (2 cores)
Clock multiplier 20
Package 1356-ball micro-FCBGA
Socket BGA1356
Size 1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date September 1, 2015 (announcement)
September 27, 2015 (availability)
End-of-Life date Last order date is January 25, 2019
Last shipment date is July 5, 2019

  

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core Skylake-U
Core stepping K1 (SR2JM)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 4 MB 16-way set associative shared cache
Level 4 cache size 64 MB
Physical memory 32 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

 
Integrated peripherals / components:

Display controller 3 displays
Integrated graphics GPU Type: Intel Iris 540
Graphics tier: GT3e
Microarchitecture: Gen 9 LP
Execution units: 48
Base frequency (MHz): 300
Maximum frequency (MHz): 1000
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • PCI Express 3.0 interface (12 lanes)
  • SATA controller
  • USB controller
  • USB OTG
  • eMMC 5.0
  • SDXC 3.0
  • Legacy I/O

 


Electrical / Thermal parameters:
 

Maximum operating temperature 100°C
Thermal Design Power 15 Watt

Contact Details
Karen.