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14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

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14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

China 14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz supplier
14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz supplier 14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz supplier

Large Image :  14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

Product Details:

Certification: ORIGINAL PARTS
Model Number: FH8066802980002 N3350

Payment & Shipping Terms:

Minimum Order Quantity: 1piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Payment Terms: T/T, PayPal, Western Union, Escrow and others
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Detailed Product Description
Porcessor Number: N3350 SR2Z7 Product Collection: Celeron Processor N Series
Code Name: Formerly Apollo Lake Market Segment: MOBILE
StatusLaunch Date: Launched Launch Date: Q3'16
Lithography: 14nm Use Conditon: PC/Client/Tablet
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CPU Processor Chip Celeron N3350 SR2Z7 ( 2M Cache, up to 2.4 GHz) - Notebook/Latop CPU

N3350 is a dual-core 64-bit x86 mobile microprocessor introduced by Intel in 2016. The processor is based on Goldmont microarchitecture and is manufactured on a 14 nm process. The chip operates at 1.1 GHz with burst frequency of 2.4 GHz and has a TDP of 6 W (SDP of 4 W).

14nm Lithography Laptop CPU Processors Celeron N3350 SR2Z7 2M Cache Up To 2.4 GHz

Processor number N3350:

Processor number N3350
Family Mobile Celeron
Technology (micron) 0.014
Processor speed (GHz) 1.1
L2 cache size (KB) 2048
The number of cores 2
EM64T Supported
HyperThreading technology Not supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

 

General information
Type System-on-a-Chip
Market segment Mobile
Family
 
Intel Mobile Celeron (Apollo Lake)
Model number N3350
SoC part number
  • FH8066802980002 is an OEM/tray SoC
Frequency 1100 MHz
Maximum turbo frequency 2400 MHz (1 core)
2300 MHz (2 cores)
Low power frequency 800 MHz
Package 1296-ball Flip Chip Ball Grid Array (Type 3)
Socket BGA1296
Size 1.22" x 0.94" / 3.1cm x 2.4cm
Introduction date August 30, 2016

 

Integrated peripherals / components
Display controller
  • 3 displays
  • MIDI-DSI 1.1 / DP 1.2 / HDMI 1.4b / eDP 1.3
  • DP output supports up to 4096 x 2160 at 60 Hz
  • eDP and HDMI supports up to 3840x2160 at 30 Hz
Integrated graphics GPU Type: Intel HD 500
Microarchitecture: Gen 9 LP
Execution units: 12
Base frequency (MHz): 200
Maximum frequency (MHz): 650
Memory controller The number of controllers: 1
Memory channels: 2
Channel width (bits): 64
Supported memory: DDR3L-1333, DDR3L-1600, DDR3L-1866, LPDDR3-1333, LPDDR3-1600, LPDDR3-1866, LPDDR4-1600, LPDDR4-2133, LPDDR4-2400
Maximum memory bandwidth (GB/s): 38.4
Other peripherals
  • PCI Express 2.0 interface (6 lanes)
  • Image Signal Processor
  • HD Audio
  • eMMC and SD-Card interfaces
  • I2S interface
  • I2C controler
  • SPI interface
  • High-Speed UART
Supported interfaces
  • 6x USB 3.0 ports
  • 2x SATA 3 ports

 

Electrical / Thermal parameters

Maximum operating temperature 105°C
Thermal Design Power 6 Watt

 

 

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