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Xeon E3-1230V3 SR153 Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ

Good quality Laptop CPU Processors for sales
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Xeon E3-1230V3 SR153 Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ

China Xeon E3-1230V3  SR153  Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ supplier
Xeon E3-1230V3  SR153  Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ supplier Xeon E3-1230V3  SR153  Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ supplier

Large Image :  Xeon E3-1230V3 SR153 Intel Xeon Server Cpu Processor 8M Cache Up To 3.3GHZ

Product Details:

Certification: Original Parts
Model Number: E3-1230V3 SR153

Payment & Shipping Terms:

Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500-2000pcs per month
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Detailed Product Description
Processor Number: E3-1230V3 SR153 Products Collection: Xeon Processor E3 V3 Family
Code Name: Haswell Vertical Segment: SERVER
Status: Discontinued Launch Date: Q2'13
Lithograph: 22nm Use Condition: Desktop /Server
High Light:

server grade cpu

,

server cpu for gaming

Server CPU Xeon E3-1230V3 SR153 Processor ( 8M Cache , Up to3.3GHZ )- Desktop Processor

XEON series has always been a black horse on the market, E3-1230 series upgraded to V3 version, based on Haswell architecture, four core eight threads, 3.3-3.7 GHz main frequency, with "i5 price, i7 performance".

Processor number E3-1230 v3

Processor number E3-1230 v3
Family Xeon
Technology (micron) 0.022
Processor speed (GHz) 3.3
L2 cache size (KB) 1024
L3 cache size (MB) 8
The number of cores 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported
Notes Uni-processing

General Information:

 
Type CPU / Microprocessor
Market segment Server
Family
 
Intel Xeon E3-1200 v3
Model number
 
E3-1230L v3
Frequency 1800 MHz.
Maximum turbo frequency 2800 MHz (1 core)
2300 MHz (2 cores)
Bus speed 5 GT/s DMI
Package 1150-land Flip-Chip Land Grid Array
Socket Socket 1150 / H3 / LGA1150
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date June 2, 2013 (launch)
June 4, 2013 (announcement)

 

Architecture / Microarchitecture:

 

Microarchitecture Haswell
Platform Denlow
Processor core Haswell LGA1150
Core stepping C0 (QEEL, QEJ7)
Manufacturing process 0.022 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • TSX / Transactional Synchronization Extensions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • TBT 2.0 / Turbo Boost technology 2.0
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TXT / Trusted Execution technology
Low power features
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology

 

Integrated peripherals / components:

 

Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-1333, DDR3-1600
DIMMs per channel: up to 2
Maximum memory bandwidth (GB/s): 25.6
ECC supported: Yes
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 3.0 interface

 

Electrical / Thermal parameters:

 

Thermal Design Power  25 Watt

Contact Details
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Contact Person: Karen.

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