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Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography

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Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography

China Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography supplier

Large Image :  Celeron G3930 CPU Processor Chip Desktop CPU 2M Cache 2.90 GHz 14nm Lithography

Product Details:

Place of Origin: ORIGINAL
Brand Name: INTEL
Certification: ORGINAL PARTS
Model Number: G3930

Payment & Shipping Terms:

Minimum Order Quantity: 1 PIECE
Price: Negotiation
Packaging Details: Tray, 15cm X 15cm X 10cm
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs/month
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Detailed Product Description
Processor No.: G3930 Product Collection: Celeron Processor G Series
Code Name: Formerly Kaby Lake Vertical Segment: Desktop
Stastus: Launched Launch Date: Q1'17
Lithography: 14nm Use Condition: Desktop/Server/Industrail PC

 

Celeron G3930 is a 64-bit dual-core budget x86 desktop microprocessor introduced by Intel in early 2017. The G3930, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's improved 14nm+ process. This processor operates at 2.9 GHz with a TDP of 51 W and supports up to 64 GiB of dual-channel DDR4-2133 ECC memory. Additionally the G3930T incorporates Intel's HD Graphics 610 IGP operating at 350 MHz with a burst frequency of 1.05 GHz.

Processor number G3930:

Processor number G3930
Family Celeron Dual-Core
Technology (micron) 0.014
Processor speed (GHz) 2.9
L2 cache size (KB) 512
L3 cache size (MB) 2
The number of cores 2
EM64T Supported
HyperThreading technology Not supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

 

General information:

General information
Type CPU / Microprocessor
Market segment Desktop
Family
 
Intel Celeron Dual-Core
Model number
 
G3930
CPU part numbers
 
  • CM8067703015717 is an OEM/tray microprocessor
  • BX80677G3930 is a boxed processor (English version)
  • BXC80677G3930 is a boxed processor (Chinese version)
Frequency 2900 MHz
Bus speed 8 GT/s DMI
Clock multiplier 29
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date January 3, 2017

 

Architecture / Microarchitecture:

Microarchitecture Kaby Lake
Processor core Kaby Lake-S
Core stepping S0 (SR35K)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 2
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 2 MB 8-way set associative shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
  • TSX / Transactional Synchronization Extensions
Low power features
  • Core C1/C1E, C3, C6, C7 and C8 states
  • Package C2, C3, C6, C7 and C8 states
  • Enhanced SpeedStep technology
Integrated peripherals / components
Display controller
  • 3 displays
  • DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics GPU Type: Intel HD 610
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals
  • Direct Media Interface 3.0 (4 lanes)
  • PCI Express 3.0 interface (16 lanes)

 

Integrated peripherals / components:

Display controller
  • 3 displays
  • DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
Integrated graphics GPU Type: Intel HD 610
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1050
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133
DIMMs per channel: 2
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals
  • Direct Media Interface 3.0 (4 lanes)
  • PCI Express 3.0 interface (16 lanes)

 

Electrical / Thermal

Maximum operating temperature 100°C
Thermal Design Power 51 Watt

parameters:

 

Contact Details
TAISHENG INT'L TECHNOLOGY(HK) LIMITED

Contact Person: Karen.

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