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Xeon E5-2630 V4 SR1YC Intel Server Chips 25M Cache Up To 2.2GHZ High Speed

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Xeon E5-2630 V4 SR1YC Intel Server Chips 25M Cache Up To 2.2GHZ High Speed

China Xeon  E5-2630 V4  SR1YC  Intel Server Chips  25M Cache Up To 2.2GHZ  High Speed supplier

Large Image :  Xeon E5-2630 V4 SR1YC Intel Server Chips 25M Cache Up To 2.2GHZ High Speed

Product Details:

Certification: Original Parts
Model Number: E5-2630 v4 SR1YC

Payment & Shipping Terms:

Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500 per month
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Detailed Product Description
Processor Number: E5-2630V4 Products Collection: Xeon Processor E5 V4 Family
Code Name: Products Formerly Broadwell Vertical Segment: SERVER
Status: Launched Launch Date: Q1'16
Lithograph: 14nm Use Condition: Server/Desktop
High Light:

server grade cpu

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server cpu for gaming

Server CPU Xeon E5-2630 v4 SR1YC Processor ( 25M Cache , Up to 2.2GHZ )- Server Desktop CPU

The Xeon E5-2630 v4 is a 64-bit deca-core x86 microprocessor introduced by Intel in 2016. This server MPU is designed for standard 2S environments (1U square form factor). Operating at 2.2 GHz with a turbo boost frequency of 3.1 GHz for a single active core, this MPU has a TDP of 85 W and is manufactured on a 14 nm process (based on Broadwell).

Processor number E5-2630 v4

Processor number E5-2630 v4
Family Xeon
Technology (micron) 0.014
Processor speed (GHz) 2.2
Bus speed (MHz) 4000 (QPI)
L2 cache size (KB) 2560
L3 cache size (MB) 25
The number of cores 10
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported
Notes Dual-processing
 
 
 

General Information:

Type CPU / Microprocessor
Market segment Server
Family
 
Intel Xeon E5-2600 v4
Model number
 
E5-2630 v4
Frequency 2200 MHz
Maximum turbo frequency 3100 MHz
Bus speed 8 GT/s QPI (4000 MHz)
Clock multiplier 22
Package 2011-land Flip-Chip Land Grid Array
Socket Socket 2011-3 / R3 / LGA2011-3
Size 2.07" x 2.01" / 5.25cm x 5.1cm
Introduction date March 31, 2016

 

Architecture / Microarchitecture:

Microarchitecture Broadwell
Platform Grantley-EP 2S
Processor core Broadwell-EP
Core stepping R0 (QKET, QKRH, SR2R7)
CPUID 406F1 (QKET, QKRH)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 10
The number of threads 20
Floating Point Unit Integrated
Level 1 cache size 10 x 32 KB 8-way set associative instruction caches
10 x 32 KB 8-way set associative data caches
Level 2 cache size 10 x 256 KB 8-way set associative caches
Level 3 cache size 25 MB 20-way set associative shared cache
Physical memory 1536 GB
Multiprocessing Up to 2 processors
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
Low power features Enhanced SpeedStep technology

 

Integrated peripherals / components:

 

Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 4
Supported memory: DDR4-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 68.3
ECC supported: Yes
Other peripherals
  • Direct Media Interface 2.0
  • Quick Path Interconnect (2 links)
  • PCI Express 3.0 interface (40 lanes)

 

 Electrical / Thermal parameters:

 

Maximum operating temperature 74°C
Minimum power dissipation 35 Watt (C1E state)
12 Watt (C6 state)
Thermal Design Power 85 Watt

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