| Item No.: | H5TC4G63CFR-PBAR | Memory Width: | 16 | 
|---|---|---|---|
| Memory Density: | 4GB | Package: | PBGA-96 | 
| Memory IC TypeLE: | DRAM MODULE | ||
| Highlight: | dynamic random access memory,ram memory ic | 
                                                    ||
![]()
| Mfr Package Description | FBGA-96 | 
| REACH Compliant | Yes | 
| EU RoHS Compliant | Yes | 
| China RoHS Compliant | Yes | 
| Status | Active | 
| Access Mode | MULTI BANK PAGE BURST | 
| JESD-30 Code | R-PBGA-B96 | 
| Memory Density | 4.294967296E9 bit | 
| Memory IC Type | DRAM MODULE | 
| Memory Width | 16 | 
| Number of Functions | 1 | 
| Number of Ports | 1 | 
| Number of Terminals | 96 | 
| Number of Words | 2.68435456E8 words | 
| Number of Words Code | 256M | 
| Operating Mode | SYNCHRONOUS | 
| Operating Temperature-Min | 0.0 Cel | 
| Operating Temperature-Max | 85.0 Cel | 
| Organization | 256MX16 | 
| Package Body Material | PLASTIC/EPOXY | 
| Package Code | TFBGA | 
| Package Shape | RECTANGULAR | 
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | 
| Peak Reflow Temperature (Cel) | 260 | 
| Seated Height-Max | 1.2 mm | 
| Supply Voltage-Nom (Vsup) | 1.35 V | 
| Supply Voltage-Min (Vsup) | 1.283 V | 
| Supply Voltage-Max (Vsup) | 1.45 V | 
| Surface Mount | YES | 
| Technology | CMOS | 
| Temperature Grade | OTHER | 
| Terminal Form | BALL | 
| Terminal Pitch | 0.8 mm | 
| Terminal Position | BOTTOM | 
| Time@Peak Reflow Temperature-Max (s) | 20 | 
| Length | 13.0 mm | 
| Width | 7.5 mm | 
| Additional Feature | AUTO/SELF REFRESH |