Item No.: | H5TC4G63CFR-PBAR | Memory Width: | 16 |
---|---|---|---|
Memory Density: | 4GB | Package: | PBGA-96 |
Memory IC TypeLE: | DRAM MODULE | ||
High Light: | dynamic random access memory,ram memory ic |
Mfr Package Description | FBGA-96 |
REACH Compliant | Yes |
EU RoHS Compliant | Yes |
China RoHS Compliant | Yes |
Status | Active |
Access Mode | MULTI BANK PAGE BURST |
JESD-30 Code | R-PBGA-B96 |
Memory Density | 4.294967296E9 bit |
Memory IC Type | DRAM MODULE |
Memory Width | 16 |
Number of Functions | 1 |
Number of Ports | 1 |
Number of Terminals | 96 |
Number of Words | 2.68435456E8 words |
Number of Words Code | 256M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 85.0 Cel |
Organization | 256MX16 |
Package Body Material | PLASTIC/EPOXY |
Package Code | TFBGA |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | 260 |
Seated Height-Max | 1.2 mm |
Supply Voltage-Nom (Vsup) | 1.35 V |
Supply Voltage-Min (Vsup) | 1.283 V |
Supply Voltage-Max (Vsup) | 1.45 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | OTHER |
Terminal Form | BALL |
Terminal Pitch | 0.8 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | 20 |
Length | 13.0 mm |
Width | 7.5 mm |
Additional Feature | AUTO/SELF REFRESH |