32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

Basic Information
Certification: Original Parts
Model Number: H9TQ26ADFTACUR-KUM
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500-2000pcs per month
Detail Information
Part Numbe: H9TQ26ADFTACUR-KUM Application: Mobile Phone
Product: EMCP Density: 32GB
NAND Information: 32+24 EMCP-D3 Package Type: 221 Ball FBGA
Dissipation Power: 5W
High Light:

mcp memory


mcp flash

Product Description

EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage





Featur and Description:


Part Number Density Organization Temperature Product Grade Voltage PKG Product Status
H9TQ26ADFTACUR-KUM 32GB SDP 1℃-100℃ IT 5v FBGA221 Mass Production

Contact Details