32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

Name: 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM
Brand: 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM
SKU: H9TQ26ADFTACUR-KUM
Rating: 4.5 (137 reviews)

Basic Information

Certification:	Original Parts
Model Number:	H9TQ26ADFTACUR-KUM

Minimum Order Quantity:	1 piece
Price:	Negotiation
Packaging Details:	10cm X 10cm X 5cm
Delivery Time:	3-5 work days
Payment Terms:	T/T, PayPal, Western Union, Escrow and others
Supply Ability:	500-2000pcs per month

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Detail Information

Part Numbe:	H9TQ26ADFTACUR-KUM	Application:	Mobile Phone
Product:	EMCP	Density:	32GB
NAND Information:	32+24 EMCP-D3	Package Type:	221 Ball FBGA
Dissipation Power:	5W
High Light:	mcp memory , mcp flash

Product Description

EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage

Featur and Description:

Part Number	Density	Organization	Temperature	Product Grade	Voltage	PKG	Product Status
H9TQ26ADFTACUR-KUM	32GB	SDP	1℃-100℃	IT	5v	FBGA221	Mass Production

Tag:

32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

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