Processor Number: | I7-4500U | Product Collection: | 4th Generation Intel Core I7 Processors |
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Status: | Launched | Socket Type: | BGA1168 |
Use Condition: | Mobile & Laptop | ||
High Light: | laptop microprocessor,mobile processor laptop |
Core i7-4500U is an ULV (ultra low voltage) dual-core processor for ultrabooks launched in Q2 2013. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 1.8 GHz, but can dynamically increase clock rates with Turbo Boost up to 3.0 GHz for 1 active core or 2.7 GHz for 2 active cores.
Intel Fourth generation and newer Core i3, Core i5 and Core i7 mobile CPUs | |
I7 | Processor family: Core i7 Mobile |
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4 | Processor generation: 4rd generation (Haswell) |
5 | Performance segment: High performance dual-core CPUs |
00 | Feature / Performance identifier |
U | Additional features and market: Ultra low power CPU (15 Watt or 28 Watt) |
Processor number | i7-4500U | |||
Family | Core i7 Mobile | |||
Technology (micron) | 0.022 | |||
Processor speed (GHz) | 1.8 | |||
L2 cache size (KB) | 512 | |||
L3 cache size (MB) | 4 | |||
The number of cores | 2 | |||
EM64T | Supported | |||
HyperThreading technology | Supported | |||
Virtualization technology | Supported | |||
EnhancedSpeedStep technology | Supported | |||
Execute-Disable bit feature | Supported | |||
General information:
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Type | CPU / Microprocessor | |||
Market segment | Mobile | |||
Family | Intel Core i7 Mobile | |||
Model number | i7-4500U | |||
CPU part number | § CL8064701477202 is an OEM/tray microprocessor | |||
Frequency | 1800 MHz | |||
Maximum turbo frequency | 3000 MHz (1 core) 2700 MHz (2 cores) |
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Bus speed | 5 GT/s DMI | |||
Clock multiplier | 18 | |||
Package | 1168-ball micro-FCBGA package (FCBGA1168) | |||
Socket | BGA1168 | |||
Size | 1.57" x 0.94" / 4cm x 2.4cm | |||
Introduction date | June 2, 2013 (launch) June 4, 2013 (announcement) |
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End-of-Life date | Last order date for tray processors is September 30, 2016 Last shipment date for tray processors is March 11, 2017 |
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Architecture / Microarchitecture:
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Microarchitecture | Haswell | |||
Platform | Shark Bay | |||
Processor core | Haswell | |||
Core stepping | C0 (SR16Z) | |||
Manufacturing process | 0.022 micron 0.96 billion transistors |
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Die | 131mm2 | |||
Data width | 64 bit | |||
The number of CPU cores | 2 | |||
The number of threads | 4 | |||
Floating Point Unit | Integrated | |||
Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
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Level 2 cache size | 2 x 256 KB 8-way set associative caches | |||
Level 3 cache size | 4 MB 16-way set associative shared cache | |||
Physical memory | 16 GB | |||
Multiprocessing | Uniprocessor | |||
Extensions and Technologies |
§ MMX instructions § SSE / Streaming SIMD Extensions § SSE2 / Streaming SIMD Extensions 2 § SSE3 / Streaming SIMD Extensions 3 § SSSE3 / Supplemental Streaming SIMD Extensions 3 § SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 § AES / Advanced Encryption Standard instructions § AVX / Advanced Vector Extensions § AVX2 / Advanced Vector Extensions 2.0 § BMI / BMI1 + BMI2 / Bit Manipulation instructions § F16C / 16-bit Floating-Point conversion instructions § FMA3 / 3-operand Fused Multiply-Add instructions § EM64T / Extended Memory 64 technology / Intel 64 § NX / XD / Execute disable bit § HT / Hyper-Threading technology § TBT 2.0 / Turbo Boost technology 2.0 § VT-x / Virtualization technology |
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Low power features | Enhanced SpeedStep technology | |||
Integrated peripherals / components:
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Integrated graphics | GPU Type: HD 4400 Graphics tier: GT2 Microarchitecture: Gen 7.5 Execution units: 20 Base frequency (MHz): 200 Maximum frequency (MHz): 1100 The number of supported displays: 3 |
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Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600, LPDDR3-1333, LPDDR3-1600 Maximum memory bandwidth (GB/s): 25.6 |
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Other peripherals |
§ Direct Media Interface 2.0 § PCI Express 2.0 interface |
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Electrical / Thermal parameters:
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Maximum operating temperature | 100°C | |||
Thermal Design Power | 15 Watt |