| Module Collection: | 4th Generation Core I7 Processors | Code Name: | Products Formerly Crystal Well |
|---|---|---|---|
| Vertical Segment: | Mobile | Launch Date: | June 2, 2013 |
| Lithography: | 22nm | Use Condition: | Notebook And Mobile |
| Highlight: | laptop chips,mobile processor laptop |
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| Intel Fourth generation and newer Core i3, Core i5 and Core i7 mobile CPUs | |
| I7 | Processor family: Core i7 Mobile |
| - | |
| 4 | Processor generation: 4rd generation (Haswell) |
| 7 | Performance segment: Performance quad-core processors |
| 50 | Feature / Performance identifier |
| HQ | Additional features and market: Mid-power quad-core processor |
| Processor number | i7-4750HQ | ||
| Family | Core i7 Mobile | ||
| Technology (micron) | 0.022 | ||
| Processor speed (GHz) | 2 | ||
| L2 cache size (KB) | 1024 | ||
| L3 cache size (MB) | 6 | ||
| The number of cores | 4 | ||
| EM64T | Supported | ||
| HyperThreading technology | Supported | ||
| Virtualization technology | Supported | ||
| Enhanced SpeedStep technology | Supported | ||
| Execute-Disable bit feature | Supported | ||
| General information | |||
| Type | CPU / Microprocessor | ||
| Market segment | Mobile | ||
| Family | Intel Core i7 Mobile | ||
| Model number | i7-4750HQ | ||
| Frequency | 2000 MHz | ||
| Maximum turbo frequency | 3200 MHz (1 core) 3100 MHz (2 cores) 3000 MHz (3 or 4 cores) | ||
| Bus speed | 5 GT/s DMI | ||
| Clock multiplier | 20 | ||
| Package | 1364-ball micro-FCBGA package (FCBGA1364) | ||
| Socket | BGA1364 | ||
| Size | 1.48" x 1.26" / 3.75cm x 3.2cm | ||
| Introduction date | June 2, 2013 (launch) June 4, 2013 (announcement) | ||
| |||
| Microarchitecture | Haswell | ||
| Platform | Shark Bay | ||
| Processor core | Crystal Well | ||
| Core stepping | C0 (SR18J) | ||
| Manufacturing process | 0.022 micron | ||
| Die | 174.4mm2 (21.8mm x 8mm) | ||
| Data width | 64 bit | ||
| The number of CPU cores | 4 | ||
| The number of threads | 8 | ||
| Floating Point Unit | Integrated | ||
| Level 1 cache size | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches | ||
| Level 2 cache size | 4 x 256 KB 8-way set associative caches | ||
| Level 3 cache size | 6 MB 12-way set associative shared cache | ||
| Level 4 cache size | 128 MB 16-way set associative shared cache | ||
| Physical memory | 32 GB | ||
| Multiprocessing | Uniprocessor | ||
| Extensions and Technologies |
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| Low power features | Enhanced SpeedStep technology | ||
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| Integrated graphics | GPU Type: Intel Iris Pro 5200 Graphics tier: GT3e Microarchitecture: Gen 7.5 Execution units: 40 Base frequency (MHz): 200 Maximum frequency (MHz): 1200 The number of supported displays: 3 | ||
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600 Maximum memory bandwidth (GB/s): 25.6 | ||
| Other peripherals |
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| Maximum operating temperature | 100°C | ||
| Thermal Design Power | 47 Watt | ||