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Core I7-6567U SR2JH I7 Sries Intel Cpu Processors 4MB Cache Up To 3.6GHz

Basic Information
Certification: ORIGINAL PARTS
Model Number: i7-6567U SR2JH
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs
Detail Information
Processor Number: I7-6567U Production Collection: The 6th Core I7 Series Processor
Code Name: Skylake Markt Segment: Mobile
Status: Announced Launch Date: Q3'15
Lithography: 14nm Use Conditon: Notebook
High Light:

laptop chips

,

mobile processor laptop


Product Description

Laptop CPU Processors Core I7-6567U SR2JH I7 Sries 4MB Cache , up to 3.6GHz - Notebook Porcessor

 

Core i7-6567U is a dual-core SoC based on the Skylake architecture. In September 2015, it's the fastest CPU of the 28 W series, which can be found in medium-sized ultrabooks and notebooks. In addition to two CPU cores with Hyper-Threading clocked at 3.3 - 3.6 GHz (2 cores: max. 3.4 GHz), the chip also integrates an Iris Graphics 550 GPU with 64 MB of eDRAM memory as well as a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

 

Processor number i7-65607U

Processor number i7-6560U
Family Core i7 Mobile
Technology (micron) 0.014
Processor speed (GHz) 3.3
L2 cache size (KB) 512
L3 cache size (MB) 4
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:

 

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i7 Mobile
Model number
 
i7-6567U
Frequency 3300 MHz
Maximum turbo frequency 3600 MHz (1 core)
3400 MHz (2 cores)
Clock multiplier 33
Package 1356-ball micro-FCBGA
Socket BGA1356
Size 1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date September 1, 2015 (announcement)
September 27, 2015 (availability)
End-of-Life date Last order date is January 25, 2019
Last shipment date is July 5, 2019

 

Architecture Microarchiteture:

 

Microarchitecture Skylake
Processor core Skylake-U
Core stepping K1 (SR2JH)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 4 MB 16-way set associative shared cache
Level 4 cache size 64 MB
Physical memory 32 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

 

Intergrated Peripherals/Components:

Display controller 3 displays
Integrated graphics GPU Type: Intel Iris 550
Graphics tier: GT3e
Microarchitecture: Gen 9 LP
Execution units: 48
Base frequency (MHz): 300
Maximum frequency (MHz): 1100
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • PCI Express 3.0 interface (12 lanes)
  • SATA controller
  • USB controller
  • USB OTG
  • eMMC 5.0
  • SDXC 3.0
  • Legacy I/O

 

 

 Eletrical/Thermal Parameters:

 

Maximum operating temperature 100°C
Thermal Design Power 28 Watt

Contact Details
Karen.