products

Core I7-7700U SR32Q Laptop CPU Processors , Intel Core I7 Notebook Processors 6MB Cache Up To 3.8GHz

Basic Information
Certification: ORIGINAL PARTS
Model Number: I7-7700HQ SR32Q
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs
Detail Information
Processorl NO.: I7-7700HQ Produce Collection: The 7th Core I7 Series Processor
Code Name: Products Formerly Kaby Lake Vertical Segment: Mobile
Status: Launched Launch Date: Q1'17
Lithography: 14nm Use Conditon: Notebook
Highlight:

laptop microprocessor

,

mobile processor laptop


Product Description

Laptop CPU Procesors Core I7-7700U SR32Q , I7 Series ( 6MB Cache , up to 3.8GHz ) - Notebook CPU

 
Core i7-7700HQ is a fast quad-core processor for notebooks based on the Kaby Lake H architecture (7th generation Core), which was announced in January 2017 at CES. It is the successor to the Core i7-6700HQ from the Skylake generation and is manufactured in an improved 14 nm+ process, so the clocks are 200 MHz higher at the same TDP. The architecture was not changed, only the video engine got an update (see our Kaby Lake article).
The integrated graphics card is called Intel HD Graphics 630, but the architecture does not differ from the 530 GPU from the Skylake generation and only the clocks are slightly higher.

 

Processor number i7-7700U

 

Processor number i7-7700U
Family Core i7 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.8
L2 cache size (KB) 1024
L3 cache size (MB) 6
The number of cores4 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:
 

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i7 Mobile
Model number
 
i7-7700HQ
Frequency 2800 MHz
Maximum turbo frequency 3800 MHz (1 core)
3600 MHz (2 cores)
3400 MHz (3 or 4 cores)
Bus speed 8 GT/s DMI
Clock multiplier 28
Package 1440-ball micro-FCBGA
Socket BGA1440
Size 1.65" x 1.1" / 4.2cm x 2.8cm
Introduction date January 3, 2017

 
Architecture Microarchiteture:
 

Microarchitecture Kaby Lake
Processor core Kaby Lake-H
Core stepping B0 (SR32Q)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 4-way set associative caches
Level 3 cache size 6 MB 12-way set associative shared cache
Physical memory 64 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features Enhanced SpeedStep technology


Intergrated Peripherals/Components:
 

Display controller 3 displays
Integrated graphics GPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1100
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-2133, DDR4-2400
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)


Eletrical/Thermal Parameters:
 

Maximum operating temperature 100°C
Thermal Design Power 45 Watt

Contact Details
Karen.