Processor No.: | I5-6200U | Family: | 6th Generation Core I5 Processors |
---|---|---|---|
Code Name: | Products Formerly Skylake | Vertical Segment: | Mobile |
Status: | Launched | Launch Date: | Q3'15 |
Lithography: | 14nm | Use Conditon: | Notebook/Laptop |
Highlight: | laptop microprocessor,laptop chips |
Laptop CPU Processors I5-6200U SR2EY Core I5 Series (3MB Cache,up to 2.8GHz ) - Notebook Processor
Core i5-6200U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.3 - 2.8 GHz (2 cores: max. 2.7 GHz), the chip also integrates an HD Graphics 520 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
Processor number i5-6200U
Processor number | i5-6200U |
Family | Core i5 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2.3 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family | Intel Core i5 Mobile |
Model number | i5-6200U |
CPU part number | · FJ8066201930409 is an OEM/tray microprocessor |
Frequency | 2300 MHz |
Maximum turbo frequency | 2800 MHz (1 core) 2700 MHz (2 cores) |
Clock multiplier | 23 |
Package | 1356-ball micro-FCBGA |
Socket | BGA1356 |
Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
Introduction date | September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere) |
Architecture Microarchiteture:
Microarchitecture | Skylake |
Processor core | Skylake-U |
Core stepping | D1 (SR2EY) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 2 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
Level 2 cache size | 2 x 256 KB 4-way set associative caches |
Level 3 cache size | 3 MB 12-way set associative shared cache |
Physical memory | 32 GB |
Multiprocessing | Not supported |
Extensions and Technologies | · MMX instructions · SSE / Streaming SIMD Extensions · SSE2 / Streaming SIMD Extensions 2 · SSE3 / Streaming SIMD Extensions 3 · SSSE3 / Supplemental Streaming SIMD Extensions 3 · SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 · AES / Advanced Encryption Standard instructions · AVX / Advanced Vector Extensions · AVX2 / Advanced Vector Extensions 2.0 · BMI / BMI1 + BMI2 / Bit Manipulation instructions · F16C / 16-bit Floating-Point conversion instructions · FMA3 / 3-operand Fused Multiply-Add instructions · EM64T / Extended Memory 64 technology / Intel 64 · NX / XD / Execute disable bit · HT / Hyper-Threading technology · VT-x / Virtualization technology · VT-d / Virtualization for directed I/O · TBT 2.0 / Turbo Boost technology 2.0 · TSX / Transactional Synchronization Extensions · MPX / Memory Protection Extensions · SGX / Software Guard Extensions |
Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics | GPU Type: HD 520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 1000 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals | · PCI Express 3.0 interface (12 lanes) · SATA controller · USB controller · USB OTG · eMMC 5.0 · SDXC 3.0 · Legacy I/O |
Electrical / Thermal parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 15Watt |