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Core I3-6100H SR2FR CPU Processor Chip I3 Series 3MB Cache Up To 2.7GHz

Good quality Laptop CPU Processors for sales
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Core I3-6100H SR2FR CPU Processor Chip I3 Series 3MB Cache Up To 2.7GHz

China Core I3-6100H  SR2FR CPU Processor Chip  I3 Series 3MB Cache Up To 2.7GHz supplier

Large Image :  Core I3-6100H SR2FR CPU Processor Chip I3 Series 3MB Cache Up To 2.7GHz

Product Details:

Certification: ORIGINAL PARTS
Model Number: I3-6100H SR2FR

Payment & Shipping Terms:

Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
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Detailed Product Description
Porcessor Number: I3-6100H Product Collection: 6th Generation Core I3 Processors
Code Name: SkyLake Market Segment: Mobile
Status: Launched Launch Date: Q3'15
Lithography: 14nm Use Conditon: NOTEBOOK / LAPTOP
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CPU Processor Chip Core I3-6100H SR2FR I3 Series (3MB Cache,up to 2.7GHz ) - Notebook CPU

 
The Core i3-6100H is a dual-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.

Processor number i3-6100H

Processor number i3-6100H
Family Core i3 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.7
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:

 

Type CPU / Microprocessor
Market segment Mobile
Family Intel Core i3 Mobile
Model number  i3-6100H
CPU part number § CL8066202194634 is an OEM/tray microprocessor
Frequency  2700 MHz
Bus speed  8 GT/s DMI
Clock multiplier  27
Package 1440-ball micro-FCBGA
Socket BGA1440
Size 1.65" x 1.1" / 4.2cm x 2.8cm
Introduction date September 1, 2015 (announcement)
September 1, 2015 (availability in Asia)
September 27, 2015 (availability elsewhere)

 

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core  Skylake-H
Core stepping  R0 (SR2FR)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size  2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size  2 x 256 KB 4-way set associative caches
Level 3 cache size 3 MB shared cache
Physical memory 64 GB
Multiprocessing Not supported
Features

§ MMX instructions

§ SSE / Streaming SIMD Extensions

§ SSE2 / Streaming SIMD Extensions 2

§ SSE3 / Streaming SIMD Extensions 3

§ SSSE3 / Supplemental Streaming SIMD Extensions 3

§ SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4

§ AES / Advanced Encryption Standard instructions

§ AVX / Advanced Vector Extensions

§ AVX2 / Advanced Vector Extensions 2.0

§ BMI / BMI1 + BMI2 / Bit Manipulation instructions

§ F16C / 16-bit Floating-Point conversion instructions

§ FMA3 / 3-operand Fused Multiply-Add instructions

§ EM64T / Extended Memory 64 technology / Intel 64 

§ NX / XD / Execute disable bit 

§ HT / Hyper-Threading technology 

§ VT-x / Virtualization technology 

§ VT-d / Virtualization for directed I/O

§ TSX / Transactional Synchronization Extensions

§ MPX / Memory Protection Extensions

§ SGX / Software Guard Extensions

Low power features Enhanced SpeedStep technology 

 

 

Integrated peripherals / components:

 

Display controller 3 displays
Integrated graphics GPU Type: HD 530
Graphics tier: GT2
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 900
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals

§ Direct Media Interface 3.0

§ PCI Express 3.0 interface (16 lanes)


Electrical / Thermal parameters:
 

Maximum operating temperature 100°C
Thermal Design Power  35 Watt

Contact Details
Beijing Silk Road Enterprise Management Services Co.,LTD

Contact Person: Karen.

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