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32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

Good quality Laptop CPU Processors for sales
Good supplier and good quality. Hope we can cooperate next time!

—— Samual-Delke Technology

all the parts are good. thank you.

—— Пантелеев Валера

the parts 100% new ! Super !

—— 정훈 공-Kong

the CPU, CHIPSET are good qulity and good price.

—— Henry Tan

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32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

China 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM supplier
32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM supplier 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM supplier 32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM supplier

Large Image :  32GNAND+24GLPD3 FBGA221 FW A4 Embedded Multi Chip Package , Mcp Flash H9TQ26ADFTACUR-KUM

Product Details:

Place of Origin: Orignal
Brand Name: SKHYNIX
Certification: Original Parts
Model Number: H9TQ26ADFTACUR-KUM

Payment & Shipping Terms:

Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500-2000pcs per month
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Detailed Product Description
Part Numbe: H9TQ26ADFTACUR-KUM Application: Mobile Phone
Product: EMCP Density: 32GB
NAND Information: 32+24 EMCP-D3 Package Type: 221 Ball FBGA
Dissipation Power: 5W

EMCP Memory Chip H9TQ26ADFTACUR-KUM -32GNAND+24GLPD3 FBGA221 FW:A4-Embedded Multi-Chip Package NEW&ORIGINAL Storage

 

 

 

 

Featur and Description:

 

Part Number Density Organization Temperature Product Grade Voltage PKG Product Status
H9TQ26ADFTACUR-KUM 32GB SDP 1℃-100℃ IT 5v FBGA221 Mass Production

Contact Details
TAISHENG INT'L TECHNOLOGY(HK) LIMITED

Contact Person: Karen.

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