products

Core I7-7820HQ SR32N , CPU Procesor Chip I7 Series ( 8MB Cache , up to 3.9GHz ) - Notebook CPU

Basic Information
Certification: ORIGINAL PARTS
Model Number: I7-7820HQ SR32N
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs
Detail Information
Processorl NO.: I7-7820HQ Family: The 7th Core I7 Series Processor
Code Name: Products Formerly Kaby Lake Vertical Segment: Mobile
Status: Launched Launch Date: Q1'17
Lithography: 14nm Use Conditon: Notebook
High Light:

computer cpu processor

,

multi core processor


Product Description

Core I7-7820HQ SR32PN ,  CPU Procesor Chip I7 Series ( 8MB Cache , up to 3.9GHz ) - Notebook CPU


Core i7-7820HQ is a fast quad-core processor for notebooks based on the Kaby Lake architecture and was announced in January 2017. It is the second fastest model of the consumer series at the time of the announcement. Only the i7-7920HQ and Xeon E3-1535M v6 are faster. Besides four cores including Hyper-Threading support running at 2.9 - 3.9 GHz (4 cores up to 3.5 GHz, 2 cores up to 3.7 GHz), the processor is also equipped with the HD Graphics 630 GPU as well as a dual-channel memory controller (DDR3L-1600/DDR4-2400). It is manufactured in a 14nm process with FinFET transistors.

 

Processor number i7-7820HQ

 

Processor number i7-7820HQ
Family Core i7 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.9
L2 cache size (KB) 1024
L3 cache size (MB) 8
The number of cores4 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:
 

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i7 Mobile
Model number
 
i7-7820HQ
Frequency 2900 MHz
Maximum turbo frequency 3900 MHz (1 core)
3700 MHz (2 cores)
3500 MHz (3 or 4 cores)
Bus speed 8 GT/s DMI
Clock multiplier 29
Package 1440-ball micro-FCBGA
Socket BGA1440
Size 1.65" x 1.1" / 4.2cm x 2.8cm
Introduction date January 3, 2017

 
Architecture Microarchiteture:

 

 

Microarchitecture Kaby Lake
Processor core Kaby Lake-H
Core stepping B0 (SR32N)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 4-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 64 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features Enhanced SpeedStep technology

 


Intergrated Peripherals/Components:

Display controller 3 displays
Integrated graphics GPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350
Maximum frequency (MHz): 1100
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-2133, DDR4-2400
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)


Eletrical/Thermal Parameters:
 

Maximum operating temperature 100°C
Thermal Design Power 45 Watt

Contact Details
Karen.