products

I3-4020Y SR1DC Mobile Device Processors 3M Cache Up To 1.5GHz Mobile Or Notebook CPU

Basic Information
Certification: ORIGINAL PARTS
Model Number: I3-4020Y SR1DC
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: Tray, 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Module Number: I3-4020Y Family: 4th Generation Core I3 Processors
CodeName: Products Formerly Haswell Market Segment: Mobile
Status: Launched Launch Date: Q3'13
Lithography: 22nm Use Condition: Notebook
High Light:

mobile core processor

,

powerful mobile processor


Product Description

Mobile Device Processors I3-4020Y SR1DC ( 3M Cache, up to 1.5GHz) - CORE I3 Processor Series Mobile /Notebook CPU
 
The Core i3-4020Y is an ULV (ultra low voltage) dual-core processor for ultrabooks and tablets which has been presented in Q3/2013. It is based on the Haswell architecture and manufactured in 22nm. Due to Hyperthreading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 1.5 GHz (no Turbo Boost support).

Model number naming conventions:

I3 Processor family: Core i3 Mobile
-  
4 Processor generation: 4rd generation (Haswell)
0 Performance segment: Affordable mid-class dual-core processors
20 Feature / Performance identifier
Y Additional features and market: Extremely low power processor (11.5 Watt for Haswell)

 

Processor number i3-4020Y

Processor number i3-4020Y
Family Core i3 Mobile
Technology (micron) 0.022
Processor speed (GHz) 1.5
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 
General Information:

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i3 Mobile
Model number
 
i3-4020Y
Frequency 1500 MHz
Bus speed 5 GT/s DMI
Clock multiplier 15
Package 1168-ball micro-FCBGA package (FCBGA1168)
Socket BGA1168
Size 1.57" x 0.94" / 4cm x 2.4cm
Introduction date September 1, 2013
End-of-Life date Last order date for tray processors is July 1, 2016
Last shipment date for tray processors is January 6, 2017
 


Architecture / Microarchitecture:

Microarchitecture Haswell
Platform Shark Bay
Processor core Haswell
Core stepping D0 (SR1DC)
Manufacturing process 0.022 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 8-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Physical memory 16 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
Low power features Enhanced SpeedStep technology

 
Integrated peripherals / components:

Integrated graphics GPU Type: HD 4200
Graphics tier: GT2
Microarchitecture: Gen 7.5
Execution units: 20 [1]
Base frequency (MHz): 200
Maximum frequency (MHz): 850
The number of supported displays: 3
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, LPDDR3-1333, LPDDR3-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 2.0 interface

 
Electrical / Thermal parameters:

Maximum operating temperature 100°C
Thermal Design Power 11.5 Watt

Contact Details
Karen.