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I3-4100U SR16P Mobile Device Processors 3M Cache Up To 3.0GHz CORE I3 Series

Good quality Laptop CPU Processors for sales
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I3-4100U SR16P Mobile Device Processors 3M Cache Up To 3.0GHz CORE I3 Series

China I3-4100U SR16P  Mobile Device Processors 3M Cache Up To 3.0GHz CORE I3  Series supplier

Large Image :  I3-4100U SR16P Mobile Device Processors 3M Cache Up To 3.0GHz CORE I3 Series

Product Details:

Place of Origin: ORIGINAL
Brand Name: INTEL
Certification: ORIGINAL PARTS
Model Number: I3-4100U SR16P

Payment & Shipping Terms:

Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: Tray, 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
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Detailed Product Description
Module Number: I3-4100U Family: 4th Generation Core I3 Processors
CodeName: Products Formerly Haswell Market Segment: Mobile
Status: Launched Launch Date: Q3'13
Lithography: 22nm Use Condition: Notebook

Mobile Device Processors I3-4100U SR16P ( 3M Cache, up to 3.0GHz) - CORE I3 Processor Series Mobile /Notebook CPU
 
The Core i3-4100U is an ULV (ultra low voltage) dual-core processor for ultrabooks launched in Q2 2013. It is based on the Haswell architecture and is manufactured in 22nm. Due to Hyper-Threading, the two cores can handle up to four threads in parallel, leading to better utilization of the CPU. Each core offers a base speed of 1.8 GHz and includes no Turbo Boost support.

 

Model number naming conventions

 
I3 Processor family: Core i3 Mobile
-  
4 Processor generation: 4rd generation (Haswell)
1 Performance segment: Affordable mid-class dual-core processors
00 Feature / Performance identifier
U Additional features and market: Ultra low power CPU (15 Watt or 28 Watt)
 
 

 Processor number i3-4100U

Processor number i3-4100U
Family Core i3 Mobile
Technology (micron) 0.022
Processor speed (GHz) 1.8
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

General Information:

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i3 Mobile
Model number
 
i3-4100U
Frequency 1800 MHz
Bus speed 5 GT/s DMI
Clock multiplier 18
Package 1168-ball micro-FCBGA package (FCBGA1168)
Socket BGA1168
Size 1.57" x 0.94" / 4cm x 2.4cm
Introduction date June 2, 2013 (launch)
June 4, 2013 (announcement)
End-of-Life date Last order date for tray processors is July 1, 2016
Last shipment date for tray processors is January 6, 2017


Architecture / Microarchitecture:

 

Microarchitecture Haswell
Platform Shark Bay
Processor core Haswell
Core stepping C0 (SR16P)
Manufacturing process 0.022 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 8-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Physical memory 16 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
Low power features Enhanced SpeedStep technology

 
Integrated peripherals / components:

 

Integrated graphics GPU Type: HD 4400
Graphics tier: GT2
Microarchitecture: Gen 7.5
Execution units: 20
Base frequency (MHz): 200
Maximum frequency (MHz): 1000
The number of supported displays: 3
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, LPDDR3-1333, LPDDR3-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 2.0 interface

 
Electrical / Thermal parameters:

 

Maximum operating temperature 100°C
Thermal Design Power 15 Watt

Contact Details
TAISHENG INT'L TECHNOLOGY(HK) LIMITED

Contact Person: Sales Manager

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