H5TQ4G63CFR-RDC Dram Memory Chip 256MX16 CMOS PBGA96 Surface Mount High Efficiency

Basic Information
Certification: ORIGINAL PARTS
Model Number: H5TQ4G63CFR-RDC
Minimum Order Quantity: 1 package
Price: Negotiation
Packaging Details: tray package, 1600/box
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 10K per month
Detail Information
Access Mode: MULTI BANK PAGE BURST Package: R-PBGA-B96
Memory Width: 16 Mounting: Surface Mount
High Light:

dynamic random access memory


ram memory ic

Product Description

Dram Memory Chip H5TQ4G63CFR-RDC DDR DRAM, 256MX16, CMOS, PBGA96
The H5TQ4G63 is a 4,294,967,296-bit CMOS Double Data Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large memory density and high bandwidth. SK Hynix 4Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched to achieve very high bandwidth.


  • VDD=VDDQ=1.5V +/- 0.075V
  • Fully differential clock inputs (CK, CK) operation
  • Differential Data Strobe (DQS, DQS)
  • On chip DLL align DQ, DQS and DQS transition with CK transition
  • DM masks write data-in at the both rising and falling edges of the data strobe
  • All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
  • Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 13 and 14 supported
  • Programmable additive latency 0, CL-1, and CL-2 supported
  • Programmable CAS Write latency (CWL) = 5, 6, 7, 8 9 and 10
  • Programmable burst length 4/8 with both nibble sequential and interleave mode
  • BL switch on the fly
  • 8banks
  • Average Refresh Cycle (Tcase of 0°C~ 95°C)
    • 7.8 µs at 0°C ~ 85°C
    • 3.9 µs at 85°C ~ 95°C Commercial Temperature( 0°C ~ 95°C) Industrial Temperature( -40°C ~ 95°C)
  • JEDEC standard 78ball FBGA(x8), 96ball FBGA (x16)
  • Driver strength selected by EMRS
  • Dynamic On Die Termination supported
  • Asynchronous RESET pin supported
  • ZQ calibration supported
  • TDQS (Termination Data Strobe) supported (x8 only)
  • Write Levelization supported
  • 8 bit pre-fetch

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