DRAM Memory Chip , K3RG3G30MM-MGCH 3gb Lpddr3 Memory Chip Storage

Lifecyle :Active

EU RoHS :Unknown

EU RoHS Version:2002/95/EC

Description: M-DIE LOW POWER DDR4 DRAM 24GB DENSITY Taxonomy

Memory > Memory Chips > DRAM Chip

Introduction Date:2016-01-19 00:00:00

ECCN:EAR99

Supplier Cage Code:1542F

Basic Package Type:Ball Grid Array

Package Family Name:BGA

Supplier Package:FBGA

Package Description:Fine Pitch Ball Grid Array

Lead Shape:Ball

Pin Count:366

PCB:366

Tab:N/R

Package Length (mm):N/A

Package Width (mm):N/A

Package Height (mm):N/A

Package Diameter (mm):N/R

Package Weight (g):N/A

Mounting:Surface Mount