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Xeon E3-1230V5 SR2LE Server CPU 8M Cache 3.40 GHz 64 Bit 4 Cores General

Basic Information
Certification: Original Parts
Model Number: E3-1230 V5 SR2LE
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: 10cm X 10cm X 5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500 per month
Detail Information
Processor Number: E3-1230V5 Products Collection: Xeon Processor E3 V5 Family
Code Name: Products Formerly Skylake Vertical Segment: Server
Status: Launched Expected Discontinuance: Q4'15
Lithograph: 14nm Use Condition: Server/Desktop
Highlight:

server cpu for gaming

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server microprocessor


Product Description

Server CPU Xeon E3-1230V5 SR2LE (8M Cache, 3.40 GHz ) Server Desktop CPU

The Xeon E3-1230 v5 is an entry-level server and workstation 64-bit quad-core x86 microprocessor introduced by Intel in October 2015. This Skylake-based chip operates at 3.4 GHz with turbo boost of 3.8 GHz. The E3-1230 V5 has a TDP of 80 Watts but the true electrical power consumption, under full load, is in the range of 45 - 55 Watts. It supports up to 64 GiB of dual-channel DDR4-2133 memory. This MPU has no integrated graphics processor.

 

Model number naming conventions :

Processor number E3-1230 v5

Processor number E3-1230 v5
Family Xeon
Technology (micron) 0.014
Processor speed (GHz) 3.4
L2 cache size (KB) 1024
L3 cache size (MB) 8
The number of cores 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported
Notes Uni-processing
 
 

General Information:

Type CPU / Microprocessor
Market segment Server
Family
 
Intel Xeon E3-1200 v5
Model number
 
E3-1230 v5
CPU part numbers
 
  • CM8066201921713 is an OEM/tray microprocessor
  • BX80662E31230V5 is a boxed microprocessor
Frequency 3400 MHz
Maximum turbo frequency 3800 MHz
Bus speed 8 GT/s DMI
Clock multiplier 34
Package 1151-land Flip-Chip Land Grid Array
Socket Socket 1151 / H4 / LGA1151
Size 1.48" x 1.48" / 3.75cm x 3.75cm
Introduction date October 19, 2015
End-of-Life date Last order date is October 26, 2018
Last shipment date is April 12, 2019

 

Architecture / Microarchitecture:

Microarchitecture Skylake
Platform Greenlow
Processor core Skylake-S
Core stepping R0 (QJ79, SR2CN, SR2LE)
CPUID 506E3 (SR2CN, SR2LE)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 4-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

 

Integrated peripherals / components:

Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
ECC supported: Yes
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)

 

 Electrical / Thermal parameters:

Thermal Design Power 80 Watt

Contact Details
Karen.