Product Details:
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| Porcessor Number: | I3-6167U SR2JF | Product Collection: | 6th Generation Core I3 Processors |
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| Code Name: | Products Formerly Kaby Lake | Vertical Segment: | Mobile |
| Status: | Launched | Launch Date: | Q3'15 |
| Lithography: | 14nm | Use Conditon: | NOTEBOOK / LAPTOP |
| High Light: | computer cpu processor,computer hardware processor |
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Core I3-6167U SR2JF CPU Processor Chip I3 Series (3MB Cache,up to 2.7GHz ) - Notebook CPU
The Core i3-6167U is a dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in medium-sized ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an Iris Graphics 550 GPU with 64 MB of eDRAM memory as well as a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
| Processor number | i3-6167U |
| Family | Core i3 Mobile |
| Technology (micron) | 0.014 |
| Processor speed (GHz) | 2.7 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General Information:
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | Intel Core i3 Mobile |
| Model number | i3-6167U |
| CPU part number | § FJ8066202498901 is an OEM/tray microprocessor |
| Frequency | 2700 MHz |
| Clock multiplier | 27 |
| Package | 1356-ball micro-FCBGA |
| Socket | BGA1356 |
| Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
| Introduction date | September 1, 2015 (announcement) September 27, 2015 (availability) |
| End-of-Life date | Last order date is October 26, 2018 Last shipment date is April 26, 2019 |
Architecture Microarchiteture:
| Microarchitecture | Skylake |
| Processor core | Skylake-U |
| Core stepping | K1 (SR2JF) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 4-way set associative caches |
| Level 3 cache size | 3 MB 12-way set associative shared cache |
| Level 4 cache size | 64 MB |
| Physical memory | 32 GB |
| Multiprocessing | Not supported |
| Extensions and Technologies |
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| Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
| Display controller | 3 displays |
| Integrated graphics | GPU Type: Intel Iris 550 Graphics tier: GT3e Microarchitecture: Gen 9 LP Execution units: 48 Base frequency (MHz): 300 Maximum frequency (MHz): 1000 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: LPDDR3-1600, LPDDR3-1866, DDR4-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
| Other peripherals |
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Electrical / Thermal parameters:
| Maximum operating temperature | 100°C |
| Thermal Design Power | 28 Watt |
Contact Person: Karen.
