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Core I3-6167U SR2JF CPU Processor Chip I3 Series 3MB Cache Up To 2.7GHz Fast

Basic Information
Certification: ORIGINAL PARTS
Model Number: I3-6167U SR2JF
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Porcessor Number: I3-6167U SR2JF Product Collection: 6th Generation Core I3 Processors
Code Name: Products Formerly Kaby Lake Vertical Segment: Mobile
Status: Launched Launch Date: Q3'15
Lithography: 14nm Use Conditon: NOTEBOOK / LAPTOP
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computer cpu processor

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Product Description

Core I3-6167U SR2JF CPU Processor Chip I3 Series (3MB Cache,up to 2.7GHz ) - Notebook CPU

 
The Core i3-6167U is a dual-core SoC based on the Skylake architecture and has been launched in September 2015. The CPU can be found in medium-sized ultrabooks as well as normal notebooks. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an Iris Graphics 550 GPU with 64 MB of eDRAM memory as well as a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.

Processor number i3-6167U

 
Processor number i3-6167U
Family Core i3 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.7
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:

 

Type CPU / Microprocessor
Market segment Mobile
Family Intel Core i3 Mobile
Model number  i3-6167U
CPU part number § FJ8066202498901 is an OEM/tray microprocessor
Frequency  2700 MHz
Clock multiplier  27
Package 1356-ball micro-FCBGA
Socket BGA1356
Size 1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date September 1, 2015 (announcement)
September 27, 2015 (availability)
End-of-Life date Last order date is October 26, 2018
Last shipment date is April 26, 2019

 

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core Skylake-U
Core stepping K1 (SR2JF)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Level 4 cache size 64 MB
Physical memory 32 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

 

Integrated peripherals / components:

Display controller 3 displays
Integrated graphics GPU Type: Intel Iris 550
Graphics tier: GT3e
Microarchitecture: Gen 9 LP
Execution units: 48
Base frequency (MHz): 300
Maximum frequency (MHz): 1000
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: LPDDR3-1600, LPDDR3-1866, DDR4-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • PCI Express 3.0 interface (12 lanes)
  • SATA controller
  • USB controller
  • USB OTG
  • eMMC 5.0
  • SDXC 3.0
  • Legacy I/O


Electrical / Thermal parameters:
 

Maximum operating temperature 100°C
Thermal Design Power 28 Watt

Contact Details
Karen.