Model No.: | I7-4870HQ | Family: | 4th Generation Core I7 Processor |
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Code Name: | Products Formerly Crystal Well | Market Segment: | Mobile |
Status: | Launched | Use Conditon: | Notebook |
Highlight: | computer hardware processor,multi core processor |
CPU Processor Chip Core I7-4870HQ SR1ZX ( 6M Cache,up to 3.7GHz ) -Notebook CPU
Core i7-4870HQ is a high-end quad-core processor for laptops launched in Q3 2014. It is based on the Haswell architecture and manufactured in 22nm. Due to Hyperthreading, the four cores can handle up to eight threads in parallel leading to better utilization of the CPU. Each core offers a base speed of 2.5 GHz but can dynamically increase clock rates with Turbo Boost up to 3.5 GHz (for 4 active cores), 3.6 GHz (for 2 active cores) and 3.7 GHz (for 1 active core). A noteworthy feature is the fast integrated graphics unit (GT3e) with eDRAM memory (128 MB, 77 mm², on-package, 102 GB/s).
Processor number | i7-4870HQ |
Family | Core i7 Mobile |
Technology (micron) | 0.022 |
Processor speed (GHz) | 2.5 |
L2 cache size (KB) | 1024 |
L3 cache size (MB) | 6 |
The number of cores | 4 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
Perfermance:
General information | |
Type | CPU / Microprocessor |
Market segment | Mobile |
Family |
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Model number |
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Frequency | 2500 MHz |
Maximum turbo frequency | 3700 MHz (1 core) 3600 MHz (2 cores) 3500 MHz (3 or 4 cores) |
Bus speed | 5 GT/s DMI |
Clock multiplier | 25 |
Package | 1364-ball micro-FCBGA package (FCBGA1364) |
Socket | BGA1364 |
Size | 1.48" x 1.26" / 3.75cm x 3.2cm |
Introduction date | July 20, 2014 |
End-of-Life date | Last order date for tray processors is September 30, 2016 Last shipment date for tray processors is March 11, 2017 |
Architecture / Microarchitecture:
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Microarchitecture | Haswell |
Platform | Shark Bay |
Processor core | Crystal Well |
Core stepping | C0 (SR1ZX) |
Manufacturing process | 0.022 micron |
Die | 174.4mm2 (21.8mm x 8mm) |
Data width | 64 bit |
The number of CPU cores | 4 |
The number of threads | 8 |
Floating Point Unit | Integrated |
Level 1 cache size | 4 x 32 KB 8-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
Level 2 cache size | 4 x 256 KB 8-way set associative caches |
Level 3 cache size | 6 MB 12-way set associative shared cache |
Level 4 cache size | 128 MB 16-way set associative shared cache |
Physical memory | 32 GB |
Multiprocessing | Uniprocessor |
Extensions and Technologies |
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Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
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Integrated graphics | GPU Type: Intel Iris Pro 5200 Graphics tier: GT3e Microarchitecture: Gen 7.5 Execution units: 40 Base frequency (MHz): 200 Maximum frequency (MHz): 1200 The number of supported displays: 3 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1333, DDR3L-1600 Maximum memory bandwidth (GB/s): 25.6 |
Other peripherals |
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Electrical / Thermal parameters:
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Maximum operating temperature | 100°C |
Thermal Design Power | 47 Watt |