Core I7-4870HQ SR1ZX CPU Processor Chip , Intel I7 Chip 6M Cache Up To 3.7GHz

Basic Information
Certification: ORIGINAL PARTS
Model Number: I7-4870HQ SR1ZX
Minimum Order Quantity: 1 piece
Price: Negotaion
Packaging Details: 10 X10X5CM
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Model No.: I7-4870HQ Family: 4th Generation Core I7 Processor
Code Name: Products Formerly Crystal Well Market Segment: Mobile
Status: Launched Use Conditon: Notebook
High Light:

computer hardware processor


multi core processor

Product Description


CPU Processor Chip Core I7-4870HQ SR1ZX ( 6M Cache,up to 3.7GHz ) -Notebook CPU

 Core i7-4870HQ is a high-end quad-core processor for laptops launched in Q3 2014. It is based on the Haswell architecture and manufactured in 22nm. Due to Hyperthreading, the four cores can handle up to eight threads in parallel leading to better utilization of the CPU. Each core offers a base speed of 2.5 GHz but can dynamically increase clock rates with Turbo Boost up to 3.5 GHz (for 4 active cores), 3.6 GHz (for 2 active cores) and 3.7 GHz (for 1 active core). A noteworthy feature is the fast integrated graphics unit (GT3e) with eDRAM memory (128 MB, 77 mm², on-package, 102 GB/s).


The Basic Feature:

Processor number i7-4870HQ
Family Core i7 Mobile
Technology (micron) 0.022
Processor speed (GHz) 2.5
L2 cache size (KB) 1024
L3 cache size (MB) 6
The number of cores 4
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported




General information
Type CPU / Microprocessor
Market segment Mobile
Intel Core i7 Mobile
Model number 
Frequency  2500 MHz
Maximum turbo frequency 3700 MHz (1 core)
3600 MHz (2 cores)
3500 MHz (3 or 4 cores)
Bus speed  5 GT/s DMI
Clock multiplier  25
Package 1364-ball micro-FCBGA package (FCBGA1364)
Socket BGA1364
Size 1.48" x 1.26" / 3.75cm x 3.2cm
Introduction date July 20, 2014
End-of-Life date Last order date for tray processors is September 30, 2016
Last shipment date for tray processors is March 11, 2017


Architecture / Microarchitecture:


Microarchitecture Haswell
Platform Shark Bay
Processor core Crystal Well
Core stepping C0 (SR1ZX)
Manufacturing process 0.022 micron
Die 174.4mm2 (21.8mm x 8mm)
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 8-way set associative caches
Level 3 cache size 6 MB 12-way set associative shared cache
Level 4 cache size 128 MB 16-way set associative shared cache
Physical memory 32 GB
Multiprocessing Uniprocessor
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • TBT 2.0 / Turbo Boost technology 2.0
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TXT / Trusted Execution technology
  • TSX / Transactional Synchronization Extensions
Low power features Enhanced SpeedStep technology


Integrated peripherals / components:


Integrated graphics GPU Type: Intel Iris Pro 5200
Graphics tier: GT3e
Microarchitecture: Gen 7.5
Execution units: 40
Base frequency (MHz): 200
Maximum frequency (MHz): 1200
The number of supported displays: 3
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1333, DDR3L-1600
Maximum memory bandwidth (GB/s): 25.6
Other peripherals
  • Direct Media Interface 2.0
  • PCI Express 3.0 interface


Electrical / Thermal parameters:


Maximum operating temperature 100°C
Thermal Design Power 47 Watt



Contact Details