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CPU Processor Chip Core I7-7820HK SR32P , I7 Series ( 8MB Cache , up to 3.9GHz ) - Notebook CPU

Basic Information
Certification: ORIGINAL PARTS
Model Number: I7-7820HK SR32P
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 500pcs
Detail Information
Processorl NO.: I7-7820HK Produce Collection: The 7th Core I7 Series Processor
Code Name: Kaby Lake Vertical Segment: Mobile
Status: Launched Launch Date: Q1'17
Lithography: 14nm Use Conditon: Notebook
High Light:

computer hardware processor

,

multi core processor


Product Description

CPU Procesor Chip Core I7-7820HK SR32P , I7 Series ( 8MB Cache , up to 3.9GHz ) - Notebook CPU


Core i7-7820HK is a fast quad-core processor for notebooks based on the Kaby Lake architecture and was announced in January 2017. It is the second fastest model of the consumer series at the time of the announcement. Only the i7-7920HQ and Xeon E3-1535M v6 are faster. Besides four cores including Hyper-Threading support running at 2.9 - 3.9 GHz (4 cores up to 3.5 GHz, 2 cores up to 3.7 GHz), the processor is also equipped with the HD Graphics 630 GPU as well as a dual-channel memory controller (DDR3L-1600/DDR4-2400). It is manufactured in a 14nm process with FinFET transistors.

 

Processor number i7-7820HK

 

Processor numberi7-7820HK
FamilyCore i7 Mobile
Technology (micron)0.014
Processor speed (GHz)2.9
L2 cache size (KB)1024
L3 cache size (MB)8
The number of cores44
EM64TSupported
HyperThreading technologySupported
Virtualization technologySupported
Enhanced SpeedStep technologySupported
Execute-Disable bit featureSupported

 

General Information:

TypeCPU / Microprocessor
Market segmentMobile
Family
 
Intel Core i7 Mobile
Model number
 
i7-7820HK
CPU part number
 
  • CL8067702870009 is an OEM/tray microprocessor
Frequency2900 MHz
Maximum turbo frequency3900 MHz (1 core)
3700 MHz (2 cores)
3500 MHz (3 or 4 cores)
Bus speed8 GT/s DMI
Clock multiplier29
Package1440-ball micro-FCBGA
SocketBGA1440
Size1.65" x 1.1" / 4.2cm x 2.8cm
Introduction dateJanuary 3, 2017

 
Architecture Microarchiteture:

MicroarchitectureKaby Lake
Processor coreKaby Lake-H
Core steppingB0 (SR32P)
Manufacturing process0.014 micron
Data width64 bit
The number of CPU cores4
The number of threads8
Floating Point UnitIntegrated
Level 1 cache size4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size4 x 256 KB 4-way set associative caches
Level 3 cache size8 MB 16-way set associative shared cache
Physical memory64 GB
MultiprocessingNot supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power featuresEnhanced SpeedStep technology


Intergrated Peripherals/Components:
 

Display controller3 displays
Integrated graphicsGPU Type: Intel HD 630
Microarchitecture: Gen 9 LP
Base frequency (MHz): 350

Maximum frequency (MHz): 1100
Memory controllerThe number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-2133, DDR4-2400
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)


Eletrical/Thermal Parameters:
 

Maximum operating temperature100°C
Thermal Design Power45 Watt

Contact Details
Karen.