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CPU Processor Chip I5-6300HQ SR2FP Core I5 Series (6MB Cache,up to 3.2GHz ) - Notebook CPU

Basic Information
Certification: ORIGINAL PARTS
Model Number: i5-6300HQ SR2FP
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Model Number: I5-6300HQ SR2FP Product Collection: 6th Generation Core I5 Processors
Code Name: Skylake Vertical Segment: Mobile
Status: Launched Launch Date: Q3'15
Lithography: 14nm Use Conditon: Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet
Highlight:

computer cpu processor

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multi core processor


Product Description

CPU Processor Chip​  I5-6300HQ SR2FP Core I5 Series (6MB Cache,up to 3.2GHz ) - Notebook CPU

The Core i5-6300HQ is a quad-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to four CPU cores (no Hyper-Threading support) clocked at 2.3 - 3.2 GHz (4 cores: max. 2.8 GHz, 2 cores: max. 3.0 GHz), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.
 
Processor number i5-6300HQ

 

Processor number i5-6300HQ
Family Core i5 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2.3
L2 cache size (KB) 1024
L3 cache size (MB) 6
The number of cores 4
EM64T Supported
HyperThreading technology Not supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported

 

General Information:

 

Type CPU / Microprocessor
Market segment Mobile
Family
 
Intel Core i5 Mobile
Model number
 
i5-6300HQ
Frequency 2300 MHz
Maximum turbo frequency 3200 MHz (1 core)
3000 MHz (2 cores)
2800 MHz (3 or 4 cores)
Bus speed 8 GT/s DMI
Clock multiplier 23
Package 1440-ball micro-FCBGA
Socket BGA1440
Size 1.65" x 1.1" / 4.2cm x 2.8cm
Introduction date September 1, 2015 (announcement)
September 1, 2015 (availability in Asia)
September 27, 2015 (availability elsewhere)

 

Architecture Microarchiteture:

Microarchitecture Skylake
Processor core Skylake-H
Core steppings N0 (SR2SK)
R0 (SR2FP)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 4 x 32 KB 8-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size 4 x 256 KB 4-way set associative caches
Level 3 cache size 6 MB 12-way set associative shared cache
Physical memory 64 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • NX / XD / Execute disable bit
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
  • TBT 2.0 / Turbo Boost technology 2.0
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
Low power features Enhanced SpeedStep technology

 

Integrated peripherals / components:

Display controller 3 displays
Integrated graphics GPU Type: HD 530
Graphics tier: GT2
Microarchitecture: Gen 9
Execution units: 24
Base frequency (MHz): 350
Maximum frequency (MHz): 950
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • Direct Media Interface 3.0
  • PCI Express 3.0 interface (16 lanes)


Electrical / Thermal parameters:
 

Maximum operating temperature 100°C
Thermal Design Power 15 Watt
CPU Processor Chip

Contact Details
Karen.