| Certification: | ORIGINAL PARTS |
|---|---|
| Model Number: | I3-7100U QLDP |
| Minimum Order Quantity: | 1 piece |
| Price: | Negotiation |
| Packaging Details: | tray, 10cmX10cmX5cm |
| Delivery Time: | 3-5 work days |
| Payment Terms: | T/T, PayPal, Western Union, Escrow and others |
| Supply Ability: | 1000pcs |
| Porcessor Number: | I3-7100U | Product Collection: | 7th Generation Core I3 Processors |
|---|---|---|---|
| Code Name: | Products Formerly Kaby Lake | Vertical Segment: | Mobile |
| Status: | Launched | Launch Date: | Q3'16 |
| Lithography: | 14nm | Use Conditon: | Industrial Commercial Temp, Embedded Broad Market Commercial Temp, PC/Client/Tablet |
| High Light: | computer cpu processor,computer hardware processor |
||
Core I5-7100U QLDP CPU Processor Chip I3 Series (3MB Cache,up to 2.4GHz ) - Notebook CPU
The Core i3-7100U is a dual-core processor of the Kaby Lake architecture. It offers two CPU cores clocked at 2.4 GHz (without Turbo Boost) and integrates HyperThreading to work with up to 4 threads at once. The architectural differences are rather small compared to the Skylake generation, therefore the performance per MHz should be very similar. The SoC includes a dual channel DDR4 memory controller and Intel HD Graphics 620 graphics card (clocked at 300 - 1000 MHz). It is manufactured in an improved 14nm FinFET process at Intel. Compare to the old Skylake Core i3-6100U, the i3-7100U offers a 100 MHz improved clock speed.
| Processor number | i3-7100U |
| Family | Core i3 Mobile |
| Technology (micron) | 0.014 |
| Processor speed (GHz) | 2.4 |
| L2 cache size (KB) | 512 |
| L3 cache size (MB) | 3 |
| The number of cores | 2 |
| EM64T | Supported |
| HyperThreading technology | Supported |
| Virtualization technology | Supported |
| Enhanced SpeedStep technology | Supported |
| Execute-Disable bit feature | Supported |
General Information:
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family |
|
| Model number |
|
| Frequency | 2400 MHz |
| Clock multiplier | 24 |
| Package | 1356-ball BGA |
| Socket | BGA1356 |
| Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
| Introduction date | August 30, 2016 |
Architecture Microarchiteture:
| Microarchitecture | Kaby Lake |
| Processor core | Kaby Lake-U |
| Core stepping | H0 (SR2ZW, SR343) |
| Manufacturing process | 0.014 micron |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
| Level 2 cache size | 2 x 256 KB 4-way set associative caches |
| Level 3 cache size | 3 MB 12-way set associative shared cache |
| Physical memory | 32 GB |
| Multiprocessing | Not supported |
| Extensions and Technologies |
|
| Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
| Display controller | 3 displays |
| Integrated graphics | GPU Type: Intel HD 620 Microarchitecture: Gen 9 LP Base frequency (MHz): 300 Maximum frequency (MHz): 1000 |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
| Other peripherals | PCI Express 3.0 interface (12 lanes) |
Electrical / Thermal parameters:
| Maximum operating temperature | 100°C |
| Thermal Design Power | 15 Watt |
