Porcessor Number: | I3-6100H | Product Collection: | 6th Generation Core I3 Processors |
---|---|---|---|
Code Name: | SkyLake | Market Segment: | Mobile |
Status: | Launched | Launch Date: | Q3'15 |
Lithography: | 14nm | Use Conditon: | NOTEBOOK / LAPTOP |
High Light: | computer cpu processor,computer hardware processor |
CPU Processor Chip Core I3-6100H SR2FR I3 Series (3MB Cache,up to 2.7GHz ) - Notebook CPU
The Core i3-6100H is a dual-core processor based on the Skylake architecture, that has been launched in September 2015. In addition to two CPU cores with Hyper-Threading clocked at 2.7 GHz (no Turbo Boost), the chip also integrates an HD Graphics 530 GPU and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The CPU is manufactured using a 14 nm process with FinFET transistors.
Processor number | i3-6100H |
Family | Core i3 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2.7 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family | Intel Core i3 Mobile |
Model number | i3-6100H |
CPU part number | § CL8066202194634 is an OEM/tray microprocessor |
Frequency | 2700 MHz |
Bus speed | 8 GT/s DMI |
Clock multiplier | 27 |
Package | 1440-ball micro-FCBGA |
Socket | BGA1440 |
Size | 1.65" x 1.1" / 4.2cm x 2.8cm |
Introduction date | September 1, 2015 (announcement) September 1, 2015 (availability in Asia) September 27, 2015 (availability elsewhere) |
Architecture Microarchiteture:
Microarchitecture | Skylake |
Processor core | Skylake-H |
Core stepping | R0 (SR2FR) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 2 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
Level 2 cache size | 2 x 256 KB 4-way set associative caches |
Level 3 cache size | 3 MB shared cache |
Physical memory | 64 GB |
Multiprocessing | Not supported |
Features |
§ MMX instructions § SSE / Streaming SIMD Extensions § SSE2 / Streaming SIMD Extensions 2 § SSE3 / Streaming SIMD Extensions 3 § SSSE3 / Supplemental Streaming SIMD Extensions 3 § SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 § AES / Advanced Encryption Standard instructions § AVX / Advanced Vector Extensions § AVX2 / Advanced Vector Extensions 2.0 § BMI / BMI1 + BMI2 / Bit Manipulation instructions § F16C / 16-bit Floating-Point conversion instructions § FMA3 / 3-operand Fused Multiply-Add instructions § EM64T / Extended Memory 64 technology / Intel 64 § NX / XD / Execute disable bit § HT / Hyper-Threading technology § VT-x / Virtualization technology § VT-d / Virtualization for directed I/O § TSX / Transactional Synchronization Extensions § MPX / Memory Protection Extensions § SGX / Software Guard Extensions |
Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics | GPU Type: HD 530 Graphics tier: GT2 Microarchitecture: Gen 9 Execution units: 24 Base frequency (MHz): 350 Maximum frequency (MHz): 900 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals |
§ Direct Media Interface 3.0 § PCI Express 3.0 interface (16 lanes) |
Electrical / Thermal parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 35 Watt |