Porcessor Number: | I3-6006U | Product Collection: | 6th Generation Core I3 Processors |
---|---|---|---|
Code Name: | Products Formerly Skylake | Market Segment: | Mobile |
Status: | Launched | Launch Date: | Q4'16 |
Lithography: | 14nm | Use Conditon: | NOTEBOOK / LAPTOP |
Highlight: | computer cpu processor,multi core processor |
CPU Processor Chip Core I3-6006U SR2JG I3 Series (3MB Cache,up to 2.0GHz ) - Notebook Processor
The Core i3-6006U is an ULV (ultra low voltage) dual-core SoC based on the Skylake architecture and has been launched in November 2016. The CPU can be found in small and light notebooks. In addition to two CPU cores with Hyper-Threading clocked at (rather low) 2 GHz (no Turbo Boost), the chip also integrates an HD Graphics 520 GPU (clocked at only 900 MHz) and a dual-channel DDR4-2133/DDR3L-1600 memory controller. The SoC is manufactured using a 14 nm process with FinFET transistors.
Processor number | i3-6006U |
Family | Core i3 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family | Intel Core i3 Mobile |
Model number ? | i3-6006U |
CPU part number | § FJ8066201931106 is an OEM/tray microprocessor |
Frequency ? | 2000 MHz |
Clock multiplier ? | 20 |
Package | 1356-ball micro-FCBGA |
Socket | BGA1356 |
Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
Introduction date | November 2016 |
Architecture Microarchiteture:
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics | GPU Type: HD 520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 900 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals |
§ PCI Express 3.0 interface (12 lanes) § SATA controller § USB controller § USB OTG § eMMC 5.0 § SDXC 3.0 § Legacy I/O |
Electrical / Thermal parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 15 Watt |