Core I3-6006U SR2UW CPU Processor Chip , Cpu Microprocessor I3 Series 3MB Cache Up To 2.0GHz

Basic Information
Certification: ORIGINAL PARTS
Model Number: I3-6006U SR2UW
Minimum Order Quantity: 1 piece
Price: Negotiation
Packaging Details: tray, 10cmX10cmX5cm
Delivery Time: 3-5 work days
Payment Terms: T/T, PayPal, Western Union, Escrow and others
Supply Ability: 1000pcs
Detail Information
Porcessor Number: I3-6006U Product Collection: 6th Generation Core I3 Processors
Code Name: Products Formerly SkyLake Code Name: Products Formerly SkyLake
Vertical Segment: Mobile Vertical Segment: Mobile
Status: Launched Status: Launched
Launch Date: Q4'16 Lithography: 14nm
Lithography: 14nm Use Conditon: NOTEBOOK / LAPTOP
High Light:

computer hardware processor


multi core processor

Product Description

Core I3-6006U SR2UW CPU Processor Chip I3 Series (3MB Cache,up to 2.0GHz ) - Notebook CPU

Core I3-6006U SR2UW CPU Processor Chip , Cpu Microprocessor  I3 Series 3MB Cache Up To 2.0GHz 0

The Core i3-6006U is an ULV dual-core processor based on the Skylake architecture, which was officially launched in November 2016. This processor is often used in thin laptops. In addition to two hyperthreading CPU cores running at (relatively low) 2.0 GHz (not Turbo Boost acceleration), the chip also integrates HD Graphics 520 graphics cards (900MHz only) and dual channel DDR4- 2133 / DDR3L-1600 memory controllers. The chip is fabricated by 14 nm process and FinFET transistor.


Processor number i3-6006U

Processor number i3-6006U
Family Core i3 Mobile
Technology (micron) 0.014
Processor speed (GHz) 2
L2 cache size (KB) 512
L3 cache size (MB) 3
The number of cores 2
EM64T Supported
HyperThreading technology Supported
Virtualization technology Supported
Enhanced SpeedStep technology Supported
Execute-Disable bit feature Supported


General Information:


Type CPU / Microprocessor
Market segment Mobile
Intel Core i3 Mobile
Model number
Frequency 2000 MHz
Clock multiplier 20
Package 1356-ball micro-FCBGA
Socket BGA1356
Size 1.65" x 0.94" / 4.2cm x 2.4cm
Introduction date November 2016


Architecture Microarchiteture:


Microarchitecture Skylake
Processor core Skylake-U
Core stepping D1 (SR2UW)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 2
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size 2 x 32 KB 8-way set associative instruction caches
2 x 32 KB 8-way set associative data caches
Level 2 cache size 2 x 256 KB 4-way set associative caches
Level 3 cache size 3 MB 12-way set associative shared cache
Physical memory 32 GB
Multiprocessing Not supported
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64
  • HT / Hyper-Threading technology
  • VT-x / Virtualization technology
  • VT-d / Virtualization for directed I/O
Security Features
  • NX / XD / Execute disable bit
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
  • SMAP / Supervisor Mode Access Prevention
  • SMEP / Secure Mode Execution Protection
Low power features Enhanced SpeedStep technology



Integrated peripherals / components:


Integrated graphics GPU Type: HD 520
Graphics tier: GT2
Microarchitecture: Gen 9 LP
Execution units: 24
Base frequency (MHz): 300
Maximum frequency (MHz): 900
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133
Maximum memory bandwidth (GB/s): 34.1
Other peripherals
  • PCI Express 3.0 interface (12 lanes)
  • SATA controller
  • USB controller
  • eMMC 5.0
  • SDXC 3.0
  • Legacy I/O

Electrical / Thermal parameters:

Maximum operating temperature 100°C
Thermal Design Power 15 Watt

Contact Details