Porcessor Number: | I3-6006U | Product Collection: | 6th Generation Core I3 Processors |
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Code Name: | Products Formerly SkyLake | Code Name: | Products Formerly SkyLake |
Vertical Segment: | Mobile | Vertical Segment: | Mobile |
Status: | Launched | Status: | Launched |
Launch Date: | Q4'16 | Lithography: | 14nm |
Lithography: | 14nm | Use Conditon: | NOTEBOOK / LAPTOP |
Use Conditon: | NOTEBOOK / LAPTOP | ||
High Light: | computer hardware processor,multi core processor |
Core I3-6006U SR2UW CPU Processor Chip I3 Series (3MB Cache,up to 2.0GHz ) - Notebook CPU
The Core i3-6006U is an ULV dual-core processor based on the Skylake architecture, which was officially launched in November 2016. This processor is often used in thin laptops. In addition to two hyperthreading CPU cores running at (relatively low) 2.0 GHz (not Turbo Boost acceleration), the chip also integrates HD Graphics 520 graphics cards (900MHz only) and dual channel DDR4- 2133 / DDR3L-1600 memory controllers. The chip is fabricated by 14 nm process and FinFET transistor.
Processor number | i3-6006U |
Family | Core i3 Mobile |
Technology (micron) | 0.014 |
Processor speed (GHz) | 2 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 3 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
General Information:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family |
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Model number |
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Frequency | 2000 MHz |
Clock multiplier | 20 |
Package | 1356-ball micro-FCBGA |
Socket | BGA1356 |
Size | 1.65" x 0.94" / 4.2cm x 2.4cm |
Introduction date | November 2016 |
Architecture Microarchiteture:
Microarchitecture | Skylake |
Processor core | Skylake-U |
Core stepping | D1 (SR2UW) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 2 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
Level 2 cache size | 2 x 256 KB 4-way set associative caches |
Level 3 cache size | 3 MB 12-way set associative shared cache |
Physical memory | 32 GB |
Multiprocessing | Not supported |
Extensions and Technologies |
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Security Features |
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Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
Integrated graphics | GPU Type: HD 520 Graphics tier: GT2 Microarchitecture: Gen 9 LP Execution units: 24 Base frequency (MHz): 300 Maximum frequency (MHz): 900 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866, DDR4-2133 Maximum memory bandwidth (GB/s): 34.1 |
Other peripherals |
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Electrical / Thermal parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 15 Watt |