Processor Number: | M3-7Y30 | Product Collection: | 7th Generation Core™ M Processors |
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Code Name: | Products Formerly Haswell | Market Segment: | Mobile |
Status: | Launched | Launch Date: | Q3'16 |
Lithographyptions Available: | 14nm | Use Condition: | Notebook |
High Light: | computer cpu processor,computer hardware processor |
Processor number | m3-7Y30 |
Family | Core m3 |
Technology (micron) | 0.014 |
Processor speed (GHz) | 1 |
L2 cache size (KB) | 512 |
L3 cache size (MB) | 4 |
The number of cores | 2 |
EM64T | Supported |
HyperThreading technology | Supported |
Virtualization technology | Supported |
Enhanced SpeedStep technology | Supported |
Execute-Disable bit feature | Supported |
Generation Imformation:
Type | CPU / Microprocessor |
Market segment | Mobile |
Family |
|
Model number | m3-7Y30 |
CPU part number |
|
Frequency | 1000 MHz |
Maximum turbo frequency | 2600 MHz (1 core) 2400 MHz (2 cores) |
Clock multiplier | 10 |
Package | 1515-ball micro-FCBGA |
Socket | BGA1515 |
Size | 0.79" x 0.65" / 2cm x 1.65cm |
Introduction date | August 30, 2016 |
Architecture / Microarchitecture:
Microarchitecture | Kaby Lake |
Processor core | Kaby Lake-Y |
Core stepping | H0 (SR2ZY, SR347) |
Manufacturing process | 0.014 micron |
Data width | 64 bit |
The number of CPU cores | 2 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 2 x 32 KB 8-way set associative instruction caches 2 x 32 KB 8-way set associative data caches |
Level 2 cache size | 2 x 256 KB 4-way set associative caches |
Level 3 cache size | 4 MB 16-way set associative shared cache |
Physical memory | 16 GB |
Multiprocessing | Not supported |
Extensions and Technologies |
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Low power features | Enhanced SpeedStep technology |
Integrated peripherals / components:
Display controller | 3 displays |
Integrated graphics | GPU Type: Intel HD 615 Graphics tier: GT2 Microarchitecture: Gen 9 LP Base frequency (MHz): 300 Maximum frequency (MHz): 900 |
Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3L-1600, LPDDR3-1866 Maximum memory bandwidth (GB/s): 29.9 |
Other peripherals | PCI Express 3.0 interface (10 lanes) |
Electrical / Thermal parameters:
Maximum operating temperature | 100°C |
Thermal Design Power | 4.5 Watt |